Triglyceride compositions useful for preparing composite panels and applications thereof

ABSTRACT

Composite panels may be prepared using a moisture resistance additive having a formulation that includes a triglyceride having a saponification value of at least 150 and an iodine value of at least 35. The additive may be used in the form of a water emulsion. The water emulsion may be prepared by dispersing the components of the additive formulation under conditions sufficient to at least partially saponify the triglyceride. The moisture resistance additive can impart resistance to moisture absorption and thickness swelling to composite panels prepared therewith.

RELATED APPLICATION DATA

This application is a Continuation Application of co-pending U.S. patentapplication Ser. No. 12/687,491, filed Jan. 14, 2010, which applicationclaims the benefit of U.S. Provisional Application Ser. No. 61/239,535,filed Sep. 3, 2009, and is a Continuation-in-Part of and claims benefitof U.S. patent application Ser. No. 12/360,655, filed Jan. 27, 2009, theentire contents of all of the applications are hereby incorporated byreference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to additives for use in preparing compositepanels. The invention particularly relates to additives useful forimparting resistance to moisture absorption and swelling to compositepanels.

2. Background of the Art

Composite boards, also known in the art as composite panels may be madefrom wood and have the features of natural wood. When manufacturingcomposite boards, such as medium density fiber (MDF) boards or particleboards, wood is first ground into wood chips of a desired size. The woodchips are then mixed with a binder in a blender until uniformly blended.

The homogenized mixture is then extruded or molded into a desired shape.The composite board may be coated with polyvinyl chloride (PVC),melamine, metal, foil, impregnated paper, wood veneer that is stainedand sealed or polyester to make the composite board decorative and wearresistant and to provide other properties. In some applications, thehardened composite board is then cut to a desired shape and size, andthen further processed by cutting, drilling, or edging to create acomponent part. The composite boards may be used as cabinets, molding,storage units, desks, or other Products.

During the last decade oriented strand board (OSB), another form ofcomposite panels, has become a particularly important wood product inthe home construction industry. Since its appearance in 1978, OSB hasbecome the most rapidly growing wood-based composite product. OSB isprimarily used as a structural panel, which in the past was dominated bysoftwood plywood.

Still another form of composite panels are the so called “gypsumboards.” Conventional gypsum wallboard or drywall is typicallymanufactured from a gypsum plaster slurry which is put between twolayers of paper. More specifically, in the conventional method, a wetslurry of gypsum is poured on a conveyor between two layers of paper,and the slurry is allowed a certain amount of time to set. In gypsumwallboard, the two layers of paper contain the slurry and provide thetensile strength required in installation and use. Gypsum boardcomposite panels may include cellulose and other materials in additionto gypsum.

It would be desirable in the art of making composite panels to increasethe moisture resistance of all such panels.

SUMMARY OF THE INVENTION

In one aspect, the invention is a composite panel prepared using amoisture resistance additive useful for preparing composite panels, themoisture resistance additive including a triglyceride having asaponification value of at least 150 and an iodine value of at least 35.

In another aspect, the invention is a method for preparing compositepanels including introducing a moisture resistance additive useful forpreparing composite panels, the moisture resistance additive including atriglyceride having a saponification value of at least 150 and an iodinevalue of at least 35, into a wet panel production process.

In still another aspect, the invention is a moisture resistance additiveuseful for preparing composite panels, the moisture resistance additiveincluding a triglyceride having a saponification value of at least 150and an iodine value of at least 35.

Another aspect of the invention is a moisture resistance additiveincluding an emulsion wherein the emulsion is prepared using aformulation including a triglyceride having a saponification value of atleast 150 and an iodine value of at least 35; a hydrocarbon wax; alinear C₁₂ to C₂₂ fatty acid; and a compound or compounds selected fromthe group consisting of an amine, an inorganic base, and mixturesthereof. The emulsion is prepared under conditions sufficient todisperse the emulsion components and at least partially saponify thetriglyceride.

In another aspect the invention relates to a moisture resistant additiveincluding an emulsion wherein the emulsion is prepared using aformulation including a triglyceride having a saponification value of atleast 150 and an iodine value of at least 35; and at least one non-ionicemulsifier; wherein, in still another aspect, the formulation is free ofa hydrocarbon wax.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

One embodiment of the invention is a composite panel prepared using amoisture resistance additive useful for preparing composite panels, themoisture resistance additive including a triglyceride having asaponification value of at least 150 and an iodine value of at least 35.Triacylglycerides (also termed triglycerides) are chemically defined asglycerol esters of fatty acids. Triglycerides useful with the presentinvention include, but are not limited to Rapeseed oil; Menhaden oil;Corn oil; Olive oil; Cacao oil; Soy oil; Linseed oil; Cottonseed oil;Lard; Mutton Tallow; Peanut oil; Horse oil; Beef Tallow; Palm oil;Butter; Palm Kernel oil; and Coconut oil. Any triglyceride may be usedas long as it has saponification and iodine values of at least 150 and35 respectively.

When the triglycerides have too much unsaturation, they may be treatedin any way known to be useful to those of ordinary skill in the art toreduce the extent of unsaturation. For example, the triglycerides may besubjected to a degree of hydrogenation.

In some embodiments, it may be desirable that the iodine value may begreater than 35. For example, in some embodiments, the iodine value maybe greater than about 45. In another embodiment, the iodine number maybe greater than about 55. In some embodiments the iodine number is fromabout 50 to about 56.

In some embodiments, the saponification value for the triglycerides isgreater than 150. For example in some embodiments the saponificationvalue is greater than about 170. In other embodiments, thesaponification value is from about 170 to 260 and in still otherembodiments, the saponification value is from about 185 to about 200.

An iodine value of a triglyceride may be determined in the followingmanner. The amount of halogen absorbed by a sample of the triglycerideis measured while the halogen acts on the sample. Then, the amount ofhalogen absorbed is converted to iodine and expressed in grams per 100 gof the sample. The iodine value is grams of iodine absorbed by 100 gramsof fat, and the degree of unsaturation of fatty acid in the sampleincreases with the iodine value. A chloroform or carbon tetrachloridesolution is prepared as a sample, and an alcohol solution of iodine andmercuric chloride or a glacial acetic acid solution of iodine chlorideis added to the sample. After the sample is allowed to stand, the iodinethat remains without causing any reaction is titrated with a sodiumthiosulfate standard solution, thus calculating the amount of iodineabsorbed. Any method of determining an iodine value that corresponds tothe known standard methods of measuring iodine values may be practicedwith the invention.

A saponification value is the milligrams of potassium hydroxide (KOH)required to saponify 1 g sample and corresponds to the sum of an acidvalue and an ester value. When the saponification value is measured inthe practice of the invention, a sample may be saponified withapproximately 0.5N potassium hydroxide in an alcohol solution, and thenexcess potassium hydroxide may be titrated with 0.5N hydrochloric acid.The saponification value of a compound increases as the number of estergroups within the compound is increased. Any method of determining asaponification value that corresponds to the known standard methods ofmeasuring saponification values may be practiced with the invention.

In the practice of the invention, in one embodiment, the moistureresistance additive comprising a triglyceride may be in the form of anaqueous emulsion. The emulsion may include other components besideswater and the triglyceride. The additional components may include, butare not limited to: hydrocarbon waxes, linear C₁₂ to C₂₂ fatty acids, aninorganic base, an amine, and mixtures thereof. Additional componentsmay also include one or more non-ionic emulsifiers, which are optionallyutilized in the absence of a hydrocarbon wax.

When a hydrocarbon wax is used, it may be selected from any of thecommercially known waxes which have a melting point of from about 120°F. (48.9° C.) to about 150° F. (65.6° C.). In some embodiments, the waxhas a melting point of from about 135° F. (57.2° C.) to about 145° F.(62.8° C.). Such waxes are typically of low volatility, exhibiting lessthan about a 10% loss in weight during standard thermogravimetricanalysis. Also, the oil content of these waxes may be typically lessthan about 1% by weight. These waxes are of a relatively high molecularweight, having an average chain length of about 36 or more carbon atoms(C₃₆ or higher). The hydrocarbon wax component may comprise any waxknown in the field of emulsions useful in preparing composite panels.

The linear C₁₂ to C₂₂ fatty acids that may be used with the inventioninclude, but are not limited to lauric acid, palmitic acid, stearicacid, behenic acid, oleic acid, linoleic acid, linolenic acid andmixtures thereof. For the purposes of this application, the term“linear”, as used to describe the fatty acids, means the carbon chainsof the fatty acid are substantially linear, having less than 5 percentof the non alpha carbons in the carbon chains being substituted with amethyl or higher alkyl group.

The acids may be saturated, unsaturated or polyunsaturated.

The aqueous emulsions may optionally include an inorganic base compound.The inorganic base compound may be selected from the group consisting ofsodium hydroxide, potassium hydroxide, cesium hydroxide, lithiumhydroxide, ammonium hydroxide, and mixtures thereof. Any inorganic aminethat is sufficiently soluble in water at a concentration sufficient tofacilitate the saponification of a triglyceride may be used withembodiments of the invention.

The aqueous emulsions may optionally include an amine. For the purposesof this application, the term amine includes any compound having anamine group. In one embodiment the amine is an alkanolamine.Alkanolamines that may be useful with the invention include, but are notlimited to, diethanolamine, triethanolamine and mixtures thereof. Anyamine that is sufficiently soluble in water at a concentrationsufficient to facilitate the saponification of a triglyceride may beused with embodiments of the invention. For example, morpholine may beused as the amine.

The aqueous emulsions may optionally include a non-ionic emulsifier. Forpurposes of the application, the term non-ionic emulsifier means a fattyacid ester of a polyalcohol, such as by way of example, sorbitan,sucrose or glycerine. In one embodiment, the non-ionic emulsifiersinclude sorbitan esters, or combinations of sorbitan esters, whichexhibit hydrophilic characteristics. In another embodiment, the sorbitanesters, or combination of sorbitan esters exhibit an HLB(Hydrophilic-Lipophilic Balance) greater than 10. In another embodiment,the sorbitan esters exhibit an HLB is greater than 12. In anotherembodiment, the sorbitan ester is selected from one or more of thefollowing: sorbitan monostearate, sorbitan isostearate, sorbitanlaurate, sorbitan oleate, sorbitan aplmitat, sorbitan sesquioleate,sorbitan monoisostearate ethoxylate, sorbitan monolaurate ethoxylate,sorbitan monooleate ethoxylate, sorbitan monopalmitate ethoxylate,sorbitan monostearate ethoxylate, sorbitan tetraoleate ethoxylate,sorbitan tetrastearate ethoxylate, sorbitan tristearate ethoxylate andsorbitan hexastearate ethoxylate, including any combination or subsetthereof.

While not wishing to be bound by any theory, it is believed that theemulsions of the invention cause the surfactant system and hydrophillesto stabilize within the cellulose/resin/wax system or gypsum/wood fibersystem, and as they dehydrate, providing a moisture resistant barrier.These emulsions may impart to the composite panels prepared therewith,one or more desirable properties such as high fluidity, foam support,bond, strength, stability, low pH, and low moisture absorption.

The emulsions useful with the invention may include the listedcomponents in a range of concentrations. The triglycerides may bepresent at a concentration of from about 10 weight percent to about 50weight percent of the emulsion. When the emulsion is prepared with nohydrocarbon waxes, the triglyceride may be present at a concentration offrom about 30 weight percent to about 50 weight percent of the emulsion.

The hydrocarbon waxes may be present at a concentration of from about 0weight percent to about 25 weight percent. In some embodiments of theinvention, when a hydrocarbon wax is used, it is present at aconcentration of from about 0.5 to 20 weight percent. In otherembodiments of the invention, when a hydrocarbon wax is used it ispresent at a concentration of from about 5 to 20 weight percent.

The linear C₁₂ to C₂₂ fatty acid may be present at a concentration offrom about 0.5 weight percent to about 3 weight percent. In someembodiments, the fatty acid is present at a concentration of from about0.5 to about 2 weight percent. In still other embodiments, the fattyacid is present at a weight concentration of from about 1 to about 1.5weight percent.

The amine may be present at a concentration of from about 0 weightpercent to about 3.0 weight percent. In some embodiments, the amine ispresent at a concentration of from about 0.5 to about 2 weight percent.In still other embodiments, the amine is present at a weightconcentration of from about 1 to about 1.5 weight percent.

The inorganic base may be present at a concentration of from about 0weight percent to about 6.0 weight percent. In some embodiments, theinorganic base is present at a concentration of from about 0.5 to about4 weight percent. In still other embodiments, the inorganic base ispresent at a weight concentration of from about 1 to about 3 weightpercent.

The non-ionic emulsifiers may be present at a concentration 0.5 weightpercent to about 10 weight percent. In some embodiments, the non-ionicemulsifier is present at a concentration of from about 1 to about 8weight percent. In still other embodiments, the non-ionic emulsifier ispresent at a weight concentration of from about 2 to about 4 weightpercent.

The moisture resistant additives of the application, in some embodimentsin the form of a water emulsion, may include, in addition, othercompositions such as surfactants, odorants, biocides (bactericides andfungicides), stabilizers, and the like.

The emulsions may be prepared using any method known to those ofordinary skill in the art of preparing additives for use in preparingcomposite panels. For example, the components of the emulsion may beheated in a vessel and agitated using a suitable means of agitation. Inone embodiment, the contents of the vessel are circulated through ahomogenizer. In another embodiment, the contents are agitated using ahigh speed mixer.

Whatever method is used, the emulsions are prepared at a temperaturesufficient to allow for the saponification of the triglyceride. Forexample, in some embodiments, the emulsions are prepared at atemperature of from about 110° F. to about 200° F. In other embodiments,a temperature of from about 120° F. to about 180° F. is used. In stillanother embodiment, a temperature of from about 130° F. to about 160° F.is used.

The method of the invention may be practiced to make composite panelsthat are prepared using wet processes and incorporating cellulose. Thecellulose may be in the form of wood or it may be from another source ortreated. Exemplary forms of cellulose include, but are not limited towood fiber, wood flakes, wood strands, wood chips, wood particles,recycled wood or paper fiber, and the like. Exemplary composite panelsinclude, but are not limited to paper boxes, oriented strand board,plywood, medium density particle board, and the like.

The method of the invention includes introducing a moisture resistanceadditive into a composite additive. For the purposes of the application,the term moisture means water in either liquid or vapor form.

The moisture resistance additive may be in the form of an emulsion. Assuch, it may be added to any of the raw materials used to prepare thepanels prior to a compression and drying. For example, in an orientedstrand board process, wood strands are combined with a resin and anemulsion of the invention. The wood, resin, and emulsion are admixed andformed onto a support material to form a preform. The preform is thensubjected to heat and pressure to form an oriented strand board.

The emulsion may be added directly to the wood. The emulsion may beadded to the binder. The emulsion may be fed into the mixer with thebinder and the wood. The emulsion may be added to the board in any waythat results in a relatively uniform distribution of the emulsionthrough the composite panel.

The emulsion of the invention may be added to a composite boardcomposition at a weight concentration of from about 0.1 to about 5weight percent. In some embodiments, the emulsion of the invention maybe added to a composite board composition at a weight concentration offrom about 0.5 to about 3 weight percent. In still other embodiments,the emulsion of the invention may be added to a composite boardcomposition at a weight concentration of from about 1 to about 2 weightpercent.

EXAMPLES

The following examples are provided to illustrate the present invention.The examples are not intended to limit the scope of the presentinvention and they should not be so interpreted. Amounts are in weightparts or weight percentages unless otherwise indicated.

Example 1

A first emulsion is prepared using the formulation shown in Table 1. Theemulsion is prepared using a homogenizer. The components shown arecommercially available and may contain small amounts of solvents.

Example 2

A second emulsion is prepared using the formulation shown in Table 1.The emulsion is prepared using a homogenizer. Oriented strand board wasmanufactured by the conventional hot press method using the emulsion ofTable 1. Wood strands were combined/admixed with a polymethylenediphenyldiisocyanate (pMDI) resin and about 1 weight percent of theemulsion of the invention in a mixer. The admixture, once mixed with theresin and the emulsion designated as Example 2 in Table 1, was formedonto a support material to make an oriented strand board pre-form. Thepre-form was then placed on a caul plate in a hot press where thefinished good is produced by applying pressures above atmospheric andtemperatures greater than room temperature. The hot press method isfurther described in U.S. Pat. No. 4,433,120 to Shui-Tung Chiu, thecontents of which are fully incorporated herein by reference. Twelveinch by twelve inch panels were cut from the finished good and testedfor density, inter-board strength, moisture absorption and thicknessswelling according to ASTM-D-1037-99. The results of the test are shownin Table 2.

Example 3

A third emulsion is prepared using the formulation shown in Table 1. Theemulsion is prepared using a homogenizer. An oriented strand board wasprepared substantially identically to that of Example 2 except that theemulsion used was that designated as Example 3 in Table 1. Twelve inchby twelve inch panels were cut from the finished good and tested fordensity, inter-board strength, moisture absorption and thicknessswelling according to ASTM-D-1037-99. The results of the tests are shownin Table 2.

Comparative Example 4

A fourth emulsion is prepared using the formulation shown in Table 1.The emulsion is prepared using a homogenizer. An oriented strand boardwas prepared substantially identically to that of Example 2 except thatthe emulsion used was that designated as Comparative Example 4 inTable 1. Twelve inch by twelve inch panels were cut from the finishedgood and tested for density, inter-board strength, moisture absorptionand thickness swelling according to ASTM-D-1037-99. The results of thetests are shown in Table 2.

TABLE 1 Example # Comparative 1 2 3 4 Beef Tallow 43 33 20 0 HydrocarbonWax 0 10 20 47 Stearic Acid 1.5 1.5 1.5 1.7 Triethyl Amine 1.3 1.3 1.31.4 KOH 0.5 0 0 0 Water 53.7 54.2 57.2 49.9

TABLE 2 Solids Density IB MA TS Example # Weight Percent of Emulsion(pcf) (PSI) (%) (%) 2  44.5* 40.95 64.93 32.3 14.3 3 42.85* 38.29 53.1430.6 13.5 Comparative 50.00* 40.64 71.57 28.0 11.8 4 *Note: Solidscontent varies slightly from formulation due to the presence of solventsin some of the formulations components.

Discussion of the Examples 1-4

An oriented strand board was prepared using two formulations of theinvention and compared to a board prepared using a conventional moistureresistance additive. As can be seen from Table 2, the Examples hadphysical properties similar to the Comparative Example's despite havingabout 9% and 12% percent fewer solids. Example 3, despite having asignificantly lower density than the Comparative Example, also had goodphysical properties. As this field is very price competitive, areduction in raw materials costs may be very significant.

Example 5

A fifth emulsion is prepared using the formulation shown in Table 3. Theemulsion is prepared using a homogenizer. The components shown arecommercially available and may contain small amounts of solvents.Oriented strand board was manufactured by the conventional hot pressmethod, described in Example 2 above with the exception thatpolymethylene diphenyldiisocyanate (pMDI) resin was replaCed withPhenolic resin along with the emulsion of Table 3.

Example 6

A sixth emulsion is prepared using the formulation shown in Table 3. Theemulsion is prepared using a homogenizer. As mentioned above, thecomponents shown are as commercially available and may contain smallamounts of solvents.

Comparative Example 7

A seventh emulsion is prepared using the formulation shown in Table 3.The emulsion is prepared using a homogenizer. An oriented strand boardwas prepared substantially identical to that of Example 5 except thatthe emulsion used was that designated as Comparative Example 7 in Table3. Twelve inch by twelve inch panels were cut from the finished good andtested for density, inter-board strength, moisture absorption andthickness swelling according to ASTM-D-1037-99. The results of the testsare shown in Table 4.

TABLE 3 Example # Comparative 5 6 7 Beef Tallow 40 40 0 Hydrocarbon Wax0 0 44 Stearic Acid 0 0 1.6 Triethyl Amine 0 0 1.3 Polyoxyethylene 1.81.8 0 sorbitan monostearate Sorbitan monostearate 1.2 1.2 0 KOH 0 0.5 0Water 57.0 56.5 53.1

TABLE 4 Solids Density IB MA TS Example # Weight Percent of Emulsion(pcf) (PSI) (%) (%) 5 43.0  42.48 55.5 65.5 35.3 Comparative 47.0* 43.5746.3 51.6 29.6 7 *Note: Solids content varies slightly from formulationdue to the presence of solvents in some of the formulations components.

Discussion of the Examples 5-7

An oriented strand board was prepared using a formulation of theinvention and compared to a board prepared using a conventional moistureresistance additive. As can be seen from Table 4, the Example showedenhanced inter-board strength and slightly higher moisture absorptionthan that of the Comparative Example's despite having about 9% percentfewer solids.

What is claimed is:
 1. A composite panel prepared using a moistureresistance additive useful for preparing composite panels, the compositepanel comprising: gypsum, cellulose, or combinations thereof; and themoisture resistance additive, wherein the moisture resistance additiveis provided as an emulsion comprising: a triglyceride having asaponification value of at least 150 and an iodine value of at least 35;at least one non-ionic emulsifier comprising a fatty acid ester of apolyalcohol; and water, wherein the moisture resistance additive is freeof hydrocarbon wax.
 2. The composite panel of claim 1 wherein thenon-ionic emulsifier comprises sorbitan esters, or combinations ofsorbitan esters, which exhibit a Hydrophilic-Lipophilic Balance ofgreater than
 10. 3. The composite panel of claim 2 wherein the non-ionicemulsifier is selected from sorbitan monostearate, sorbitan isostearate,sorbitan laurate, sorbitan oleate, sorbitan aplmitat, sorbitansesquioleate, sorbitan monoisostearate ethoxylate, sorbitan monolaurateethoxylate, sorbitan monooleate ethoxylate, sorbitan monopalmitateethoxylate, sorbitan monostearate ethoxylate, sorbitan tetraoleateethoxylate, sorbitan tetrastearate ethoxylate, sorbitan tristearateethoxylate, sorbitan hexastearate ethoxylate and combinations thereof.4. The composite panel of claim 2 wherein the non-ionic emulsifier is amonostearate emulsifier selected from polyoxyethylene sorbitanmonostearate, sorbitan monostearate and combinations thereof.
 5. Thecomposite panel of claim 1 wherein the moisture resistance additivefurther comprises a compound or compounds selected from the groupconsisting of an amine, an inorganic base, and mixtures thereof, and atleast partially saponify the triglyceride, wherein the amine, whenpresent, comprises from 0.5 to 3 weight percent of the emulsion, andwherein the inorganic base, when present, comprises from 0.5 to 6 weightpercent of the emulsion, and mixtures thereof.
 6. A method for preparingcomposite panels, comprising: introducing a moisture resistance additiveinto a wet panel production process, the moisture resistance additive isprovided as an emulsion comprising: a triglyceride having asaponification value of at least 150 and an iodine value of at least 35;at least one non-ionic emulsifier comprising a fatty acid ester of apolyalcohol; and water, wherein the moisture resistance additive is freeof hydrocarbon wax.
 7. The method of claim 6 wherein the non-ionicemulsifier comprises sorbitan esters, or combinations of sorbitanesters, which exhibit a Hydrophilic-Lipophilic Balance of greater than10.
 8. The method of claim 7 wherein the non-ionic emulsifier isselected from sorbitan monostearate, sorbitan isostearate, sorbitanlaurate, sorbitan oleate, sorbitan aplmitat, sorbitan sesquioleate,sorbitan monoisostearate ethoxylate, sorbitan monolaurate ethoxylate,sorbitan monooleate ethoxylate, sorbitan monopalmitate ethoxylate,sorbitan monostearate ethoxylate, sorbitan tetraoleate ethoxylate,sorbitan tetrastearate ethoxylate, sorbitan tristearate ethoxylate,sorbitan hexastearate ethoxylate and combinations thereof.
 9. The methodof claim 7 wherein the non-ionic emulsifier is a monostearate emulsifierselected from polyoxyethylene sorbitan monostearate, sorbitanmonostearate and combinations thereof.
 10. The method of claim 6 whereinthe moisture resistance additive further comprises a compound orcompounds selected from the group consisting of an amine, an inorganicbase, and mixtures thereof, and at least partially saponify thetriglyceride, wherein the amine, when present, comprises from 0.5 to 3weight percent of the emulsion, and wherein the inorganic base, whenpresent, comprises from 0.5 to 6 weight percent of the emulsion, andmixtures thereof.
 11. The method of claim 10 wherein the moistureresistance additive is introduced into the composite panel by applyingthe moisture resistance additive to a cellulose component used to makethe composite panel.
 12. A moisture resistance additive useful forpreparing composite panels comprising: a triglyceride having asaponification value of at least 150 and an iodine value of at least 35;and at least one non-ionic emulsifier comprising a fatty acid ester of apolyalcohol, wherein the moisture resistance additive is free ofhydrocarbon wax.
 13. The moisture resistance additive of claim 12wherein the moisture-resistance additive is in the form of an emulsion.14. The moisture resistance additive of claim 12 wherein the non-ionicemulsifier comprises sorbitan esters, or combinations of sorbitanesters, which exhibit a Hydrophilic-Lipophilic Balance of greater than10.
 15. The moisture resistance additive of claim 13 wherein thenon-ionic emulsifier is selected from sorbitan monostearate, sorbitanisostearate, sorbitan laurate, sorbitan oleate, sorbitan aplmitat,sorbitan sesquioleate, sorbitan monoisostearate ethoxylate, sorbitanmonolaurate ethoxylate, sorbitan monooleate ethoxylate, sorbitanmonopalmitate ethoxylate, sorbitan monostearate ethoxylate, sorbitantetraoleate ethoxylate, sorbitan tetrastearate ethoxylate, sorbitantristearate ethoxylate, sorbitan hexastearate ethoxylate andcombinations thereof.
 16. The moisture resistance additive of claim 13wherein the non-ionic emulsifier is a monostearate emulsifier selectedfrom polyoxyethylene sorbitan monostearate, sorbitan monostearate andcombinations thereof.
 17. The moisture resistance additive of claim 12wherein the moisture resistance additive further comprises a compound orcompounds selected from the group consisting of an amine, an inorganicbase, and mixtures thereof, and at least partially saponify thetriglyceride, wherein the amine, when present, comprises from 0.5 to 3weight percent of the emulsion, and wherein the inorganic base, whenpresent, comprises from 0.5 to 6 weight percent of the emulsion, andmixtures thereof.
 18. The moisture resistance additive of claim 13wherein the emulsion is heated to a temperature sufficient to at leastpartially saponify the triglyceride.